Semiconductor Machine

• Wire saw (KOMATSU)
• Wrap machine (HAMAI)
• Polish machine (SPEEDFAM)
• CMP (ACCRETECH)
• Fully automatic grinder (OKAMOTO)
• Dicing machine (ACCRETECH)

Clean

• Clean room (DAIKIN)
• Booth (KOHKEN)

Wet

• Wet station (SCREEN)
• Pure water device (KOMATSU ELECTRONICS)

Dry

• Diffusion (TEL)
• Vapor deposition (ULVAC)
• CVD (TEL)
• Spatter (ULVAC)
• Dry etcher (SHIBAURA ELETCH)

FDP

• Laser scraper (OPTO SYSTEM)
• Beveling (ACCRETECH)
• Stepper machine (NIKON)
• UV Lamp (NITTO DENKO)

Optical Lenses

• Fully automatic grinder (NAGASE)
• Wrap machine (HAMAI)
• Polish machine (SPEEDFAM)
• Aspheric lens machine (SHIBAURA)

SMT Line

• Loder / Unloader (HIRATA)
• Board Cleaner (SAMCO)
• Printer (YAMAHA)
• Solder 3D inspection machine (SAKI)
• Chip mounter machine (PANASONIC)
• Solder visual inspection machine (YAMAHA)
• Lead-free reflow (SENJYU)